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钯溅射靶,
Palladium sputtering target
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别名
7440-05-3
钯溅射靶,
Palladium sputtering target
基本信息
应用 | Palladium sputtering target is used for standard scanning electron microscopy (SEM) coating. It is utilized to cover as specimen with a thin layer of conducting material viz. palladium. It is needed to prevent charging of specimen with an electron beam in conventional SEM mode as well as to increase signal to noise ratio. |
备注 | Typical composition of alloy: Al 95.8-98.6%, Mg 0.8-1.2%, Si 0.4-0.8%, Cr 0.04-0.35%, Cu 0.15-0.4%, Fe 0.7% max, Zn 0.25% max, Mn 0.15% max, Ti 0.15% maxIncompatible with strong acids, halogens, bases and alcohols. |
MDL | MFCD00011167 |
EINECS | 231-115-6 |
灵敏度 | Ambient temperatures. |
形态 | ≈154g/target |
溶解性 | Insoluble in water. |
安全信息
TSCA | 否 |