百灵威科技
4-Carboxybenzaldehyde
4-羧基苯甲醛
氟锂钠钾熔盐, Flinak molten salt
N-甲酰基甘氨酸乙酯, N-Formylglycine Ethyl Ester
Ethyl 5-hydroxy-1,2-dimethyl-1H-indole-3-carboxylate
1,2-二甲基-5-羟基-1H-吲哚-3-甲酸乙酯
Methoxyacetic Acid
甲氧基乙酸
四甲基硫酸氢铵一水合物, Tetramethylammonium hydrogen sulfate monohydrate
2-Methoxypyridine-3-boronic acid
2-甲氧基吡啶-3-硼酸
KMUH(N-(κ-马来酰亚胺基十一烷酸)酰肼, KMUH (N-(κ-Maleimidoundecanoic acid) hydrazide
1,3-Dimethoxybenzene
1,3-二甲氧基苯
[(1R,2R)-2-氨基-1,2-二苯基乙基(甲磺酰胺基)](对伞花烃)钌(II)四氟硼酸盐, [(1R,2R)-2-amino-1,2-diphenylethyl(methanesulfonamido)](p-cymene)ruthenium(II) tetrafluoroborate
4-(-苯基磺酰基)-1,2-环氧丁烷, 4-(-Phenylsulfonyl)-1,2-epoxybutane
2,3,5-三-O-苄基-4-O-甲磺酰基-L-阿拉伯糖, 2,3,5-Tri-O-benzyl-4-O-methylsulfonyl-L-arabinose
2,3-O-异亚丙基-4-O-甲磺酰基-5-O-三苯甲基-L-核糖-O-叔丁基二甲基硅烷-肟, 2,3-O-Isopropylidene-4-O-methylsulfonyl-5-O-triphenylmethyl-L-ribose-O-t-butyldimethylsilyl-oxime
2,3-O-异亚丙基-5-O-三苯甲基-L-核糖-O-叔丁基二甲基硅烷-肟, 2,3-O-Isopropylidene-5-O-triphenylmethyl-L-ribose-O-t-butyldimethylsilyl-oxime
2,3,4-三-O-苄基-D-核糖, 2,3,4-Tri-O-benzyl-D-ribose